| 摘要 |
PURPOSE:To prevent contamination of a semiconductor chip, deterioration of characteristics with solder flux, etc., at the time of adhering discrete chip components, and to eliminate influence of heat radiation of the components to the chip. CONSTITUTION:A plurality of substrates 11a-11d in which conductor interconnections are formed and semiconductor chip placing positions are punched, are laminated, formed with recesses 12, 13, the interconnections of the substrates 11a-11d are connected to conductor materials filled through holes TH formed in thickness direction of the substrates to form a multilayer substrate 10. Semiconductor chips 20a, 20b are assembled in bottoms of the recesses 12, 13, and sealed by a sealing material 14 secured to the surface of the substrate 10. Discrete chip components 30a-30e are assembled at a position isolated at a predetermined interval from the recesses 12, 13 on the interconnections on the surface of the substrate 10. |
