| 摘要 |
PURPOSE:To make it possible to inspect a soldering junction at a central part of a chip easily at a high speed with high accuracy with regard to an inspecting apparatus for a soldering junction of a semiconductor device. CONSTITUTION:A soldering-junction inspecting apparatus is used for a semiconductor device having a semiconductor chip 1 and a substrate 3, which are bonded together through soldering bumps 5 and 7 formed on the semiconductor chip 1. The soldering-junction inspecting apparatus includes an X-ray source 12 for irradiating a soldering junction 2, and an X-ray detecting means 14 for detecting an X-ray that has been transmitted through the soldering junction 2. Moreover, the soldering-junction inspecting apparatus includes a multi-valued shading data forming means 25 for generating multi-valued shading data on the detected X-ray from the output of the X-ray detecting means 14, and a soldering-junction abnormality judging means 30 for judging whether or not there is a change in shading in a given region of the soldering junction by using the multi-valued shading data. |
