| 摘要 |
PURPOSE: To enable heat curing by using a mixed soln. contg. thermosetting phenolic resin, aminoplast and a specified photo-acid generating agent and specifying the molar ratio of the ring substd. hydroxyl groups of the phenolic resin to the alkoxyl groups of the aminoplast. CONSTITUTION: Thermosetting phenolic resin, aminoplast having at least one alkoxyl group per one molecule and enough to give a developable latent image after exposure and a photo-acid generating agent capable of liberating an acid when exposed to active energy are dissolved in a solvent and a photoresist soln. contg. the resultant mixed soln. is prepd. A substrate is coated with a photoresist contg. the phenolic resin and aminoplast so that the molar ratio of the ring substd. hydroxyl groups of the phenolic resin to the alkoxyl groups of the aminoplast is regulated to 1.0-20.0. After drying, the photoresist is exposed with patterned active radiation, cured at about 70-160 deg.C and developed. The photoresist is a negative working photoresist contg. phenolic resin, a crosslinking agent activated by heat, etc., and is heat-cured. |
