| 摘要 |
PURPOSE:To obtain a packaging apparatus and the manufacturing method for a semiconductor device in which an electrical conduction can easily be obtained. CONSTITUTION:A translucent substrate 1 with an interconnecting layer and its electrode 2 that have been formed thereon is coated with a translucent insulating resin 5 of ultraviolet ray hardening type. An electrode 4 is formed on one face of a first semiconductor image sensor chip 3, and the rear face is picked up through vacuum suction with a sucking apparatus. Then, the first semiconductor image sensor chip 3 is moved and put closely onto the substrate 1. In a similar method, a secondary chip 3 is put onto the substrate 1. Pressure heads 7 are gently put in accordance with the reverse faces of the two chips, and while the two chips are separately under pressure at least one time through the pressure heads with pressure units 6 so that electrodes 2 and 4 are electrically connected together in the resin 5. Moreover, the resin 5 is hardened with an ultraviolet source 10 so that the two chips are fixed and the image sensor is formed. |
