| 摘要 |
PURPOSE:To satisfactorily secure a lead frame to a circuit board and to mount circuit components on both side surfaces of the board in the case of manufacturing a mold package type hybrid IC. CONSTITUTION:A pedestal 13 for placing a circuit board of a lead frame 11 is matched to a profile of the board, formed in two parallel slender shapes, coated with high melting point cream solder 20, and a part in contact with the pedestal 13 of the rear surface of the board 14 is metallized. The solder 20 is melted to secure the board 14 to the frame 11, the rear surface side of the board 14 is disposed inside the pedestal 13, and circuit components are placed on both sides of the board 14. |
