| 摘要 |
PURPOSE:To form a bump on an inner lead of a TAB tape without using a large-scale apparatus easily with accuracy. CONSTITUTION:A wire ball bump 33 is formed in an inner lead on the face of a TAB tape through wire bonding. In this case, a torn off part 34 is generated on the upper face of the wire ball bump 33. Then, the upper face of the wire ball bump 33 is fixed and smoothed by a tool so that a smoothed face 35 of the bump is formed and the height of the bump is uniformed. |
