CORRECTING METHOD FOR PRINTED WIRING BOARD-INTEGRATED MOLDED FORM

摘要

PURPOSE:To obtain a method for correcting a printed circuit board-integrated molded form, in which warpage of a housing can be reduced after an integral molding. CONSTITUTION:A warpage of a housing 1 molded integrally with a printed wiring board 2 is mounted between an upper mold 6 and a lower mold 10 in which many fine protrusions 11 are formed on a surface, and the mold 6 is pressed by a pressing device 8 in a state that vibration is applied to the mold 10 by an ultrasonic vibrator 12 to correct the warpage.