发明名称 MULTILAYER PRINTED CIRCUIT BOARD FOR PHOTO JOINT
摘要 PURPOSE:To stabilize junction conditions and prevent an inner-layer printed circuit board from being burnt when performing photo joint of IC parts in a multilayer printed circuit board. CONSTITUTION:In a lower-side region 10 of a joint 7 of IC parts where laser beam and light beam are illuminated, joint conditions are stabilized for preventing an inner-layer printed circuit board 3 from being burnt without performing blackening treatment 9 to the inner-layer copper foil pattern 6 and by preventing reflection and dispersion even is laser beam and light beam are transmitted through a base 4 of the printed circuit board 2 and 3 and then reach the inner-layer copper foil pattern 6, and the conversion into absorbed heat.
申请公布号 JPH04359492(A) 申请公布日期 1992.12.11
申请号 JP19910133154 申请日期 1991.06.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIDA KAZUTO
分类号 B23K26/00;B23K26/20;H05K3/46 主分类号 B23K26/00
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