发明名称 |
MULTILAYER PRINTED CIRCUIT BOARD FOR PHOTO JOINT |
摘要 |
PURPOSE:To stabilize junction conditions and prevent an inner-layer printed circuit board from being burnt when performing photo joint of IC parts in a multilayer printed circuit board. CONSTITUTION:In a lower-side region 10 of a joint 7 of IC parts where laser beam and light beam are illuminated, joint conditions are stabilized for preventing an inner-layer printed circuit board 3 from being burnt without performing blackening treatment 9 to the inner-layer copper foil pattern 6 and by preventing reflection and dispersion even is laser beam and light beam are transmitted through a base 4 of the printed circuit board 2 and 3 and then reach the inner-layer copper foil pattern 6, and the conversion into absorbed heat. |
申请公布号 |
JPH04359492(A) |
申请公布日期 |
1992.12.11 |
申请号 |
JP19910133154 |
申请日期 |
1991.06.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NISHIDA KAZUTO |
分类号 |
B23K26/00;B23K26/20;H05K3/46 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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