| 摘要 |
<p>A thermally conductive electronic assembly, comprising an electronic device (10) capable of producing heat during operation and a thermally conductive substrate (12). The substrate is coupled to the device by a thermally conductive material (13) that is compliant at a temperature near or below the device operating temperature. The thermally conductive material (13) is placed between the device (10) and the substrate (12) and is in direct contact with both the device and the substrate in order to conduct heat from the device. An adhesive/sealant (14) is provided between the device (10) and the substrate (12) in order to contain the thermally conducting material (13).</p> |
