| 摘要 |
<p>PURPOSE:To facilitate pitch adjustment and prevent collision of silicon wafer with a groove edge. CONSTITUTION:A pure quartz rod is ground in the angle of 50 deg. at the surface tapered by 60 deg.. Thereafter, an Y-shaped groove is formed by grinding a straight groove 4 in the angle of 40 deg.. When an angle of a perpendicular line of the bottom surface of the straight groove 4 for the base surface is set to about 40 deg. and angle of a perpendicular line of the boundary line between the tapered surface 3 and the side surface of straight groove 4 is set to about 50 deg., the bottom surface of straight groove 4 is no longer parallel with the boundary line and the tapered surface 3 may be more shifted upward than the conventional surface. Therefore, since an allowable difference in the width of tapered surface of the groove may be widened, pitch adjustment can be realized easily and a silicon wafer is never collided with an edge of the groove.</p> |
