| 摘要 |
PURPOSE:To achieve that a long sheetlike object is coated with a solder automatically and selectively. CONSTITUTION:A lead frame 70 is passed, in the horizontal direction, through a groove which is formed of a lower mold 30 and an upper mold 40; it is coated with a molten solder 12 in a solder-well 32 formed in the lower mold 30. A solder stopper is formed inside the groove which is formed of the lower mold 3 and the upper mold 40; a solder-coating region is regulated by the solder stopper and by a gas pressure supplied from inert-gas introduction holes 42, 44 in the upper mold 40. Since the flow of the molten solder 12 supplied from a solder pump 26 becomes a gentle laminar flow due to the solder well 32 formed in the lower mold 30, it is possible to avoid that a eutectic layer is stripped. |
