| 摘要 |
<p>A novel semiconductor chip cooling apparatus (10) includes at least one semiconductor die (12) packaged according to a TAB design. A support structure (14) supports the die (12), and a dike (22) is connected to the support structure (14) and the TAB tape (20) to form a cavity (34) impervious to liquid and air. Input (24) and output (26) means are connected to the cavity (34). Fluid means circulate throughout the cavity (34) and utilize the input (24) and output (26) means to directly cool the die (12) during operation of the semiconductor die (12). Heat spreading means (32) may be positioned below the die (12) to increase the amount of surface area which contacts the fluid means, thereby cooling the die (12) more efficiently.</p> |
