| 摘要 |
<p>PURPOSE:To reduce the outward-form size of the title structure and to enhance the mounting density and the reliability of the title structure. CONSTITUTION:In a mounting structure, semiconductor devices 1 arm mounted on a bonding lead frame 6 constituted of the following: a lead frame 2 in which electric circuits are constituted and whose sheet thickness is thin; and a ceramic sheet 5 which is coupled to said lead frame 2. In the mounting structure, three grooves 5a are formed on the side of one face of the ceramic sheet 5 so as to avoid semiconductor-device mounting parts, and parts whose strength is weak are formed in the ceramic sheet 5. Even when a thermal stress is exerted on the ceramic sheet 5, cracks are produced in the parts of the grooves 5a. Since the semiconductor devices 1 are mounted so as to avoid the parts of the grooves 5a, the semiconductor devices 1 are not subjected to an external force caused by the cracks, and their reliability is enhanced. Since the sheet thickness of the lead frame 2 is formed to be thin, a gap between adjacent electric-circuit patterns can be made small, the outward-form size of the title structure can be made small after its resin sealing operation, and a high-density mounting operation can be performed.</p> |
