| 摘要 |
PURPOSE:To solve the problems involved in a conventional green sheet method and thick film printing method and materialize a fault-free multilayer board which has many flat laminations on an insulating board, in the manufacture of a ceramic multilayer wiring board as electric circuit technology for high performance promotion and high density promotion of electric equipment. CONSTITUTION:A transfer sheet, which contains much resin and plasticizer, is transfered as a first layer on an alumina board 11, and thereon a transfer sheet, which contains little resin and plasticizer and includes a wiring layer 12, is transfered or the same transfer sheet as the said one is transferable again, thus one or two kinds of transfer sheets are transfered and stacked continuously or alternately, whereby it becomes excellent in the adhesion with the board or the adhesion between each sheet, and also by increasing or reducing the thickness between each sheet, the contents of the resin and the plasticizer of the laminate at large can be controlled, so a multilayer wiring board without defects can be gotten after baking. |
