<p>A thermally conductive electronic assembly, comprising an electronic device (10) capable of producing heat during operation and a thermally conductive substrate (12). The substrate is coupled to the device by a thermally conductive material (13) that is compliant at a temperature near or below the device operating temperature. The thermally conductive material (13) is placed between the device (10) and the substrate (12) and is in direct contact with both the device and the substrate in order to conduct heat from the device. An adhesive/sealant (14) is provided between the device (10) and the substrate (12) in order to contain the thermally conducting material (13).</p>
申请公布号
WO9222090(A1)
申请公布日期
1992.12.10
申请号
WO1992US04215
申请日期
1992.05.19
申请人
MOTOROLA, INC.
发明人
DARVEAUX, ROBERT, F.;MULLEN, WILLIAM, B., III;THOMPSON, KENNETH, R.;BARTLETT, MICHAEL, H.