| 摘要 |
PURPOSE:To provide a ceramic substrate which may be manufactured easily by enlarging an allowable range of via pad forming position and alleviating position control accuracy. CONSTITUTION:After a ceramics mold material 3 forming a via hole 2 is baked, a via pad 4a covering the via hole 2 and a surface layer wiring 5 connected to the via pad 4a are formed. Thereby, the via hole 2 and the surface layer wiring 5 are connected as a circuit on the ceramic substrate. The via pad 4a is formed not in the normal circular shape and the maximum diameter direction Dmax of the via pad 4a is matched with a direction Z where compression amount at the time of baking of the ceramic mold material 3 becomes maximum. |
