PACKAGING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide the title packaging method capable of simultaneously discharging the functions of junction step with a substrate of a semiconductor device and airtight sealing step of lower part of the semiconductor device. CONSTITUTION:Firstly, a semiconductor device 5 with its electrode pads surface turned upward is arranged in a cap frame 10 so as to be bond-fixed to the cap frame 10 using a bonding agent 13 coated on the inner surface of a flange 11 of the cap frame 10. Next, bumps 3 and the electrode pads 6 aligned with one another are pressurized to be pressure-welded so that the opening end of the cap frame 10 may be bond-fixed to a substrate 1 leaving the pressure- welded state intact.