PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE,申请号JP19910006035-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04355932(A)	申请公布日期	1992.12.09
申请号	JP19910006035	申请日期	1991.01.23
申请人	MATSUSHITA ELECTRIC WORKS LTD	发明人	KUZUHARA KAZUNARI
分类号	H01L21/60;H01L23/04	主分类号	H01L21/60
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Makeup composition

Moisturizing compositions

Method of preparing dendrons and dendrimers with heterocyclic substructures of imino-ethers and derivatives using non-standard means and microwaves

Injection seeded, Q-switched fiber ring laser

Catheter with direction orientation

EMI filter and frequency filters having capacitor with inductance cancellation loop

System and method for generating liquidity

DPSK demodulator and demodulating method

Method for differentiated digital voice and music processing, noise filtering, creation of special effects and device for carrying out said method

Piezoelectric element and method for manufacturing

Method and apparatus for forming angled vias in an integrated circuit package substrate

Vertically stacked field programmable nonvolatile memory and method of fabrication

Systems and methods for personalizing audio data

Film grain simulation technique for use in media playback devices

Handheld computing device for performing multitasks in healthcare applications

Multi-chip package structure

Personal digital key and receiver/decoder circuit system and method

Automated telephone number transfer

Light emitting diodes including pedestals