| 摘要 |
PURPOSE:To provide a high-density wiring board manufacturing method which can lay conductors on a high-density wiring board having triple and quadruple intersections in a less number of processes and at a high speed and, at the same time, can stably stick the conductors to the wiring board. CONSTITUTION:An adhesive layer 11 at a section where a conductor 12 is buried in the layer 11 is activated (thermally softened) by irradiating the part with a laser beam 20 from a YAG laser oscillator 21 from two lateral directions through optical fibers 23 and, at the same time, the frictional force between the conductor 12 and a stylus 30 to be used for burying the conduct 12 in the layer 11 is relieved by applying vibrations of an audible frequency to the stylus 32. |
