| 摘要 |
PURPOSE:To provide a multilayer printed wiring board having a non-through connection through hole in easy steps. CONSTITUTION:In a method for manufacturing a multilayer wiring board having a nonthrough connection through hole 12, nonplated resin 5 such as Teflon, etc., is filled in partial hole of an inner layer, multilayers are formed, a through hole is formed at the board, normally through hole-plated, thereby forming a blind viahole (non-through connection through hole 12) to be connected only between the inner layer and an outer layer. Thus, an inner viahole 11 is easily formed in the inner layer. |
