发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To prevent the outflow of an adhesive used for the junction between a frame body and a circuit board. CONSTITUTION:This has a frame body 10, where a stairs-shaped stepped part 21 which has a horizontal plane 21h which contacts with the periphery on the side of the wiring face of a circuit board 50 and is joined with the circuit board with an adhesive is made at the inner sidewall, and at the wiring face of the circuit board is made the dummy wiring 54 by a circuit pattern which is made inside a minute interval apart from the inside boundary 21a of the contact area with the horizontal plane. It follows that the surplus adhesive, which is protruded out of the adhesive interposed between the horizontal plane and the circuit board, comes to be reserved in the minute space between the inside boundary and the dummy wiring, and the adhesive is prevented from flowing into the wiring face of the circuit board over the dummy wiring.
申请公布号 JPH04354361(A) 申请公布日期 1992.12.08
申请号 JP19910157677 申请日期 1991.05.31
申请人 NIPPONDENSO CO LTD 发明人 KATSUYAMA HIDEKAZU;MOTOYAMA YUJI;MAEDA YUKIHIRO
分类号 H01L25/00;H01L23/50;H01L25/04;H01L25/07;H01L25/18;H05K1/02;H05K1/14 主分类号 H01L25/00
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