发明名称 Wafer supporting jig and a decompressed gas phase growth method using such a jig
摘要 A there is disclosed a wafer supporting jig that allows formation of a film with an even thickness on a wafer as well as a decompressed gas-phase growth method utilizing such a jig. A wafer supporting jig according to the invention is realized in the form of a ring made of a heat-resistive material having a central opening.
申请公布号 US5169684(A) 申请公布日期 1992.12.08
申请号 US19900528483 申请日期 1990.05.25
申请人 TOYOKO KAGAKU CO., LTD. 发明人 TAKAGI, YOUJI
分类号 C30B25/12;C30B31/14;H01L21/673;H01L21/687 主分类号 C30B25/12
代理机构 代理人
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