发明名称 |
Wafer supporting jig and a decompressed gas phase growth method using such a jig |
摘要 |
A there is disclosed a wafer supporting jig that allows formation of a film with an even thickness on a wafer as well as a decompressed gas-phase growth method utilizing such a jig. A wafer supporting jig according to the invention is realized in the form of a ring made of a heat-resistive material having a central opening.
|
申请公布号 |
US5169684(A) |
申请公布日期 |
1992.12.08 |
申请号 |
US19900528483 |
申请日期 |
1990.05.25 |
申请人 |
TOYOKO KAGAKU CO., LTD. |
发明人 |
TAKAGI, YOUJI |
分类号 |
C30B25/12;C30B31/14;H01L21/673;H01L21/687 |
主分类号 |
C30B25/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|