| 摘要 |
A circuit board for automatically interconnecting electrical components mounted on the circuit board, comprising of a nonconducting emulsion layer sandwiched between two nonconducting outer layers. Electrical leads from electronic components are inserted through holes in one outer layer. Dispersed within the emulsion layer are conducting particles with an elongated length. The emulsion layer's melting temperature is lower than the outer layers allowing movement of the conducting particles when the temperature of the emulsion layer is above the melting temperature, and prevents movement when the temperature is below. Included with the circuit board is an electromagnetic and infrared (EIR) assembly positioned near the outer layer opposite the layer with the electronic components. The EIR assembly has an infrared source and two magnetic field generating devices. One produces a magnetic field parallel to the emulsion layer forcing the conducting particles to line up parallel to the emulsion layer. The elongated length is sufficient so each parallel positioned conducting particle comes into contact with any neighboring parallel positioned particle, thus forming a conducting path. The other produces a magnetic field perpendicular to the emulsion layer forcing the conducting particles to line up perpendicular, electrically isolating the conducting particles from any neighboring particles. Moving the EIR assembly across the circuit board generating the parallel magnetic field forms a conducting path, or generating the perpendicular magnetic field erases any conducting paths. The infrared source is used to raise the temperature of the emulsion layer.
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