| 摘要 |
A vacuum-actuated tool for handling of electronic articles, such as integrated circuit chips, wherein the tool includes an elongated body having first, second, and third passageways. The second passageway is connected to a vacuum source, while the first passageway leads to a pickup tip that contacts the article to be handled. Positive pressure sealing provides a leak-proof closure of the second passageway when the article is to be released. The third passageway is in fluid communication with the atmosphere and is linked to the first passageway simultaneously with the positive pressure sealing of the second passageway. In a pickup position, the third passageway to the atmosphere is pressure sealed to prevent leakage through the third passageway to the atmosphere. The pressure seals are provided by elastomeric members.
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