发明名称 |
APPARATUS FOR SEPARATING SEMICONDUCTOR CHIPS |
摘要 |
: An apparatus for making a semiconductor device by individually separating semiconductor chips formed on a wafer, comprises a flexible mat, support shafts for supporting the mat in a substantially horizontal position, and a pressing plate having a generally convex body and being supported for movement up and down. A drive mechanism vertically moves the pressing plate and the wafer relative to one another. The wafer has first and second surfaces opposite each other, with the chips formed on the first surface. The wafer is placed on the mat with the chips confronting the mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer. The apparatus simplifies the process and avoids damaging the chips. |
申请公布号 |
CA1311314(C) |
申请公布日期 |
1992.12.08 |
申请号 |
CA19880565564 |
申请日期 |
1988.04.29 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIGUCHI, MASANORI;SEKIGUCHI, TAKESHI;TATO, NOBUYOSHI |
分类号 |
B28D5/00 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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