| 摘要 |
PURPOSE:To automatically mount several semiconductor parts of different sizes and types on a printed substrate simultaneously. CONSTITUTION:A device is provided with a supply device 2 which unloads one of a number of ICs laminated and contained lengthwise and mounts it on a tray, a tray supply device 3 which consists of a mobile unit which moves pallets mounted and supported on another tray to a sequence shelf at once and an intermediate mechanical centering device 8 which positions a flat pack IC and inspects the state of a lead terminal. The device consists of an unloading X-Y robot 7 to move the flat pack IC from the tray supply device 3 to the intermediate mechanical centering device, a mounting X-Y robot 10 which attracts and holds the flat pack IC on the intermediate mechanical centering device 8 or an IC from a longitudinal stick supply device 2, moves and mounts it on a specified mounting position on a printed substrate 14 and a belt conveyor device 15 which supplies and positions the printed substrate 14 on a specified package position. |
