发明名称 THICK FILM HYBRID INTEGRATED CIRCUIT BOARD
摘要 <p>PURPOSE:To perform laser trimming without restriction of a patter disposition between upper and lower layers by irradiating only a resistor along a trimming line set on the resistor with a laser light. CONSTITUTION:A straight trimming line of a cutout 11 which advances in a width W direction of a resistor 9, is so set only on the resistor 9 from a cutout starting position 11a to an ending position 11b as to be disposed on a conductor line. The resistor 9 to be laser trimmed is electrically insulated from the pattern of the lower layer. The trimming uses a YAG laser to irradiate only the resistor 9 along the trimming line with laser light. The resistor 9 and an insulating layer of its lower layer are cut out by irradiation with the light, and hence the trimming can be conducted only in the resistor in a shallow cutout depth.</p>
申请公布号 JPH04354179(A) 申请公布日期 1992.12.08
申请号 JP19910129135 申请日期 1991.05.31
申请人 HITACHI LTD 发明人 TOZAKI HIROMI;SUZUKI SHINJI;MATSUMOTO KUNIO;ENDO TSUNEO
分类号 H01C7/00;H01C17/24;H01C17/242;H01L27/01;H05K1/16;H05K3/46 主分类号 H01C7/00
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