发明名称 |
THICK FILM HYBRID INTEGRATED CIRCUIT BOARD |
摘要 |
<p>PURPOSE:To perform laser trimming without restriction of a patter disposition between upper and lower layers by irradiating only a resistor along a trimming line set on the resistor with a laser light. CONSTITUTION:A straight trimming line of a cutout 11 which advances in a width W direction of a resistor 9, is so set only on the resistor 9 from a cutout starting position 11a to an ending position 11b as to be disposed on a conductor line. The resistor 9 to be laser trimmed is electrically insulated from the pattern of the lower layer. The trimming uses a YAG laser to irradiate only the resistor 9 along the trimming line with laser light. The resistor 9 and an insulating layer of its lower layer are cut out by irradiation with the light, and hence the trimming can be conducted only in the resistor in a shallow cutout depth.</p> |
申请公布号 |
JPH04354179(A) |
申请公布日期 |
1992.12.08 |
申请号 |
JP19910129135 |
申请日期 |
1991.05.31 |
申请人 |
HITACHI LTD |
发明人 |
TOZAKI HIROMI;SUZUKI SHINJI;MATSUMOTO KUNIO;ENDO TSUNEO |
分类号 |
H01C7/00;H01C17/24;H01C17/242;H01L27/01;H05K1/16;H05K3/46 |
主分类号 |
H01C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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