PRODUCTION OF PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND PRINTED CIRCUIT BOARD

摘要

PURPOSE:To offer a photosensitive resin compsn. which can be developed with a diluted alkali aq. soln. and has excellent property for punching, resolution, heat resistance and resistance against gold plating. CONSTITUTION:This photosensitive resin compsn. consists of a photopolymerizable unsatd. compd.(a), a compd.(b) having at least one epoxy group, and a sensitizer or sensitizer system (c) which produces free radicals by active ray. The compd.(a) is obtd. by allowing secondary hydroxyl groups in the reaction product of novolac type epoxy resin and unsatd. carboxylic acid to react with a satd. or unsatd. polybasic acid anhydride with the acid eq./hydroxyl group eq. ratio ranging from 0.1 to 0.8 and then adding satd. or unsatd. monoisocyanate to the residual hydroxyl groups.