A process for replenishing a tin-lead alloy displacement plating solution which comprises periodically adding complexing agent to the solution during use of the same to bring the total concentration of complexing agent to an amount sufficient to ensure adhesion of the deposit to its underlying substrate.
申请公布号
US5169692(A)
申请公布日期
1992.12.08
申请号
US19910794479
申请日期
1991.11.19
申请人
SHIPLEY COMPANY INC.
发明人
COUBLE, EDWARD C.;FLORIO, STEVEN M.;STANIUNAS, RICHARD F.