Thick-film circuit element on a ceramic substrate

摘要

A thick-film switch element includes a high-temperature glass frit fused to a ceramic substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thickness of the switch element layer is approximately equal to the original thickness of the glass frit layer. The exposed surface of the resulting thick-film switch element product is substantially smooth and the joint between the low-temperature cermet layer and the high-temperature glass frit layer is substantially uniform.