| 摘要 |
<p>PURPOSE:To reduce electromagnetic effect on other electronic device near the electronic device using this semiconductor device, by a method wherein the energies of electromagnetic waves, which are emitted by power-source current including high-frequency components and flowing in a semiconductor chip and by power-source current including high-frequency components and flowing out from the chip, are reduced. CONSTITUTION:A lead 3 for power supply use and a lead 4 for grounding use are arranged in such a way that a power-supply current, which flows in a semiconductor chip 1 through the lead 3 for power supply use and for supplying a supply voltage to the chip 1, and a power-supply current, which flows out from the chip 1 through the lead 4 for grounding use and for supplying an earth voltage to the chip 1, are made to flow in inverse-parallel to each other.</p> |
