发明名称 JIG FOR WIRE BONDING
摘要 PURPOSE:To provide a wire bonding jig which entirely eliminate any possibility of causing the damage or the like to a mounting board and can perform required wire bonding with high accuracy. CONSTITUTION:In a wire bonding jig which is equipped with a fixing state 3 on which to place a mounting board 2, a positioning member 4 which catches one end of the mounting board 2 placed on the fixing stage 3, and a pressing member 5 which is arranged opposite to the positioning member 4 and presses the other end face of the mounting board 2 placed on the fixing stage 3, the side contacting with the mounting board 2 of the pressing member 5 is constituted of an elastic resin layer 7. The elastic resin layer 7 easily and effectively absorbs the force of catching pressing it, the occurrence of flexure or warp regarding the mounting board 2, and others. Accordingly, the problems of causing chipping of or damage to the mounting board 2 can be eliminated while securing enough positioning and fixation of the mounting board 2 in the wiring bonding process.
申请公布号 JPH04352437(A) 申请公布日期 1992.12.07
申请号 JP19910126399 申请日期 1991.05.30
申请人 TOSHIBA CORP 发明人 MATSUMOTO TADASHI
分类号 H01L21/60 主分类号 H01L21/60
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