| 摘要 |
PURPOSE:To constitute a semiconductor device into a compact structure even if the number of leads is increased and to ensure sufficiently the freedom of the aspect of a design, such as the arrangement of the leads. CONSTITUTION:A semiconductor device is characterized in that the device is provided with a semiconductor chip 1 and a plurality of leads 41, 42, 43 and 44 connected to the chip 1 via conductor wires 5, the leads 41, 42, 43 and 44 are respectively formed of a rectangular frame shaped conductor encircling the chip 1 and at the same time, the leads 41, 42, 43 and 44 are so formed via insulators 81, 82, 83 and 84 a as to encircle the chip 1. |
