发明名称 METHOD AND APPARATUS FOR WIRE BONDING
摘要 PURPOSE:To detect the level of a bonding face with high accuracy. CONSTITUTION:The displacement in the up-and-down direction of an arm holder which has held a capillary is detected one after another by using a linear sensor. It is investigated whether changes C1, C2,... Cn in an output data within a detected range B of the number of definite readout operations are within a definite permissible range C. When they are within the definite permissible range C, the range is judged to be a bonding face.
申请公布号 JPH04352336(A) 申请公布日期 1992.12.07
申请号 JP19910153916 申请日期 1991.05.29
申请人 SHINKAWA LTD 发明人 MOCHIDA TORU;TERAKADO YOSHIMITSU;HIRAYANAGI TERUHIRO
分类号 H01L21/60;H01L21/00 主分类号 H01L21/60
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