| 摘要 |
PURPOSE:To provide the manufacture of a ceramic multilayer board, in which the ceramic multilayer board free of coming off or peeling off and excellent in uniformity and mechanical strength can be manufactured, by solving the problem of being difficult to manufacture the ceramic multilayer board free of coming off or peeling off, because the adhesive strength of a transfer sheet is small, in the manufacture of the ceramic multilayer substrate to be used for various electronic circuit boards. CONSTITUTION:The title method has at least a process for forming an adhesion layer through applying an ink composed of a binder and plasticizer and a solvent to the transfer surface of a transfer sheet and drying the transfer sheet and a process for transferring the transfer sheet onto an insulator board composed of sintered alumina board, forsterite board or steatite board. Thus, transferring properties of the transfer sheet are improved and it is possible to manufacture the ceramic multilayer board excellent in uniformity and mechanical strength with a good yield. |
