| 摘要 |
PURPOSE:To surely judge the quality of bonding wires connected to a semiconductor chip surface by using the image from an fixed and set imaging means. CONSTITUTION:The connection surface of the bonding wire 13 of a semiconductor chip 11 is illuminated at an angle theta by a diffused light from a light source 14 set in a first direction, the surface of the chip 11 is picked up at the angle thetafrom a second direction opposite to the first direction by an imaging means 15. In this imaging means 15, a mapped image of a bonding wire 13, which is reflected on the surface of the chip 11, is obtained as well as the real image of the bonding wire 13 on the chip surface, so that the coordinates of the center location of the real image and coordinates of the center location of the mapped image are calculated in a wire detecting means 23 of an image processing device 17. In a height calculating means 24, the height of the bonding wire 13 from the chip surface is calculated based on the angle theta and the coordinates of the real image and the mapped image, so that whether being good or bad is judged by a judging means 25 and is outputted. |
