POWER SEMICONDUCTOR MODULE

摘要

PURPOSE:To prevent damage to a semiconductor chip during its sealing with epoxy resin in the constitution of a power semiconductor module. CONSTITUTION:A terminal support frame 11 is provided between a silicone rubber layer 9 and an epoxy resin layer 10 which are formed for sealing on the top of a semiconductor chip 4, thereby allowing a pressure of the injected epoxy resin caused by thermal expansion during heat setting to escape into a space 12 in the bottom of the terminal support frame 11.