发明名称 MULTILAYERED PRINTED BOARD
摘要 <p>PURPOSE:To provide a multilayered printed beard harder to develop resin cracks than a prior art multilayered printed board using prepreg as the insulating layer, with a low permittivity, and harder to develop barrel cracks than a prior art multilayered printed board using an impregnated coating sheet, a coating sheet, or an impregnated sheet. CONSTITUTION:A multilayered printed wiring board which is a laminate of signal circuit layers 3 and a metal core 5 or other signal circuit layers 3 by means of insulating layers 4 is so constituted as to use a filler impregnated sheet made of a foaming fluororesin sheet impregnated with a vitreous filler 6 as the above-mentioned insulating layer 4.</p>
申请公布号 JPH04349694(A) 申请公布日期 1992.12.04
申请号 JP19910123502 申请日期 1991.05.28
申请人 FUJITSU LTD 发明人 SHOJI KAZUHIRO;NAKAMURA AKIRA;KOBAYASHI TAKANORI
分类号 H05K1/05;H05K3/46 主分类号 H05K1/05
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