| 摘要 |
PURPOSE:To sufficiently absorb thermal expansion of a suspension pin during resin molding and to prevent cutting stress from concentrating on the sealant upon cutting of the suspension pin extending out of the sealant. CONSTITUTION:In a semiconductor package P comprising: a tab 4 which supports a semiconductor pellet 5; a suspension pin 3 formed integrally with this tab 4; outer leads connected to electrodes of the semiconductor pellet 5; and a sealant which seals joints of the pellet 5 and outer leads 2 and the pellet, the suspension pin 3 is divided into a plurality of narrow segments in a zone outside the sealant. |
