发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To implement a miniaturization and a weight reduction. CONSTITUTION:A given circuit is structured by providing GaAs FETs 14a and 14b for a semiconductor element, capacitors 16c and 22, and others for a circuit element. The capacitor 22 in the power terminal part 20 inserted in parallel to the power source wires of the circuit is arranged to pinch a dielectric layer 24 with a lower electrode board 25 and an upper electrode board 25 in the thickness direction of an insulating substrate 12 on a part where the insulting substrate 12 and a power source terminal 21 are formed. Also, the power source terminal 21 is fixed to the upper electrode board 25 of the capacitor 22. A space on the insulating substrate 12 can be shared by the capacitor 22 and power terminal 21 for installation thereby to reduce the mounting area for the power terminal part 20. Thus, the miniaturization and weight reduction of an apparatus can be easily implemented.</p>
申请公布号 JPH04349656(A) 申请公布日期 1992.12.04
申请号 JP19910121581 申请日期 1991.05.28
申请人 TOSHIBA CORP 发明人 KINOSHITA YOSHIHIRO
分类号 H01L23/12;H01L23/50;H01L25/00 主分类号 H01L23/12
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