| 摘要 |
PURPOSE:To provide the wire bonding structure wherein a gold wire for connecting a semiconductor chip and a lead frame can be made shorter. CONSTITUTION:In an LSI package wherein a semiconductor chip 101 and a lead frame 103 are wire-bonded with a gold wire 104, etc., a side face of a wire-bonding pad 105 formed on a side face of the semiconductor chip and side face of a wire-bonding pad 106 formed on a side face of the lead frame are wire-bonded horizontally. |
