| 摘要 |
PURPOSE:To allow the removal of an oxide layer formed on copper wirings without peeling polyimide by using acetic acid as an etching agent. CONSTITUTION:The etching agent using the acetic acid is exemplified by 100% acetic acid, an aq. soln. of the acetic acid or a mixture composed of the acetic acid and aq. of other compd. The acetic acid concn. in the aq. acetic acid soln. is preferably 0.1 to 30vol.% of water. The treating time is preferably in a 1sec to 20 minutes, more preferably 1 to 5 minutes range. The treating time is shorter and, therefore, the peeling of the polyimide is easier, if the acetic acid concn. is too high. On the other hand, the treating time is long and a problem, such as peeling of the polyimide, arises if the concn. is too low. The treating temp. is preferably 5 to 60 deg.C, more preferably 10 to 35 deg.C. A method of immersing a laminate into a chamber contg. the acetic acid is preferable as the treating method. |
