| 摘要 |
PURPOSE:To conduct stable bonding work with less load fluctuation by first controlling a bonding load to a value between an impact load value and a load setting value when a bonding tool moves downward and collides with the surface to be joined and thereafter setting the bonding load to the load setting value. CONSTITUTION:First, when a bonding load setting value Fa is set from a bonding load setter 15, a main controller 13 fetches the bonding load setting value Fa and sets it therein. Next, when speed of capillary 4 moving downward is input by the key operation from a search speed setter 14, the main controller 13 fetches such speed and sets therein. Thereafter, the main controller 13 obtains an impact load f for an electrode 3 of the capillary 4 moving downward. A bonding load value Fs is obtained by calculating Fs=(f+Fa)/2 from the bonding load setting value Fa and impact load f. The bonding is conducted first with the bonding load value Fs and then conducted again with the bonding load value Fa. |
