发明名称 METHOD FOR CUTTING GLASS PART
摘要 PURPOSE:To precisely cut a small-sized or intricately shaped glass part at a low cost by irradiating the surface-treated glass with a laser beam and irradiating the glass part. CONSTITUTION:A glass sheet 2 coated with an opaque film 1 by vapor deposition as shown in (a) as an example of heat treatment is fixed on the stage of a CO2 laser beam machine. The surface to be vapor-deposited is irradiated with a laser beam as shown in (b), hence the laser beam is converted into heat on the surface, and the glass is melted. The molten glass part 3 is matted to lower the transmittance to the laser beam, heat is again produced, and the glass is melted. The process is repeated, the laser beam finally pierces through the sheet 2 as shown in (c), and the glass is completely cut. The remaining vapor-deposited film is removed by etching. Ion plating, printing, org. film coating or various matting methods are exemplified as the surface treatment.
申请公布号 JPH04349133(A) 申请公布日期 1992.12.03
申请号 JP19910123622 申请日期 1991.05.28
申请人 SEIKO EPSON CORP 发明人 SASAKI SHIGEMI;MOROZUMI AKIRA
分类号 B23K26/00;B23K26/40;C03B33/08;C03C15/00;C03C17/00;C03C17/32;C03C19/00 主分类号 B23K26/00
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