| 摘要 |
PURPOSE:To provide a semiconductor chip with a function to switch an internal operation without increasing current consumption by changing the configuration of bonding connection. CONSTITUTION:As shown in Figure 1(a), a signal conductor pattern 1 is located near metal patterns 2, 3 for pin-bonding a power supply and a GND. As shown in Figures (b) and (c), either of bonding regions 4a, 5a for a power supply and a GND is so installed as to stretch over the metal pattern and the signal conductor pattern 1. |
