| 摘要 |
<p>PURPOSE:To provide a new multi-chip semiconductor device by narrowing the wiring area of a circuit board on which a semiconductor device is mounted and shortening a wiring film by narrowing the area and improving the integration. CONSTITUTION:A plurality of resin-sealed semiconductor devices are overlapped, multilayer interconnection boards 7 are provided between the external leads 5 of the overlapped semiconductor devices and the external leads 5 of the semiconductor devices are electrically taken out to the external through the multilayer interconnection boards 7.</p> |
