| 摘要 |
<p>PURPOSE:To improve a resistance value change of a printed resistor to be used for a multilayer hybrid integrated circuit by approximating thermal expan sion coefficient of an insulating resin layer to that of a substrate, and providing the printed resistor between the board and the layer. CONSTITUTION:A first conductive passage 3 is formed on a hybrid integrate circuit substrate 1 through an insulating resin layer 2, and a second conductive passage 5 is formed on the passage 3 through a first insulating resin layer 4 so set that alpha (thermal expansion coefficient) is approximated to alpha of the substrate. A printed resistor 6 is formed between the layer 4 and the substrate 1. Thus, a TCR of the resistor can be set to a small value, and the resistor having a small change due to high temperature conservation, can be formed. As a result, a multilayer hybrid integrated circuit having the resistor which has excellent reliability, can be realized.</p> |
