<p>A sputter coating system employing a vacuum chamber. A movable surface is provided within the chamber which is adapted for mounting substrates and moving them thereon. At least one magnetron sputtering device is positioned at a work station adjacent to the substrate holder and adapted for sputtering at least a selected material onto the substrate. At least a second device is positioned adjacent the first device for providing a plasma for enhancing the plasma formed by the first device. <IMAGE></p>
