| 摘要 |
A prepreg impregnated with an epoxy resin composition useful for a chip-on-board, copper foil-laminated board and having high heat resistance, dimensional stability and silver migration-preventing properties, which contains an aromatic polyamide fiber base material of up to 3.0 wt % in equilibrium water content, up to 80 ppm in extracted sodium content and up to 50 ppm in extracted chlorine content and an epoxy resin composition comprising an epoxy resin and a curing agent, containing up to 5 ppm of sodium and up to 600 ppm of chlorine and being impregnated by said base material. <IMAGE> |
