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发明名称
MULTILAYER INTERCONNECTION FORMING METHOD
摘要
申请公布号
JPH04346460(A)
申请公布日期
1992.12.02
申请号
JP19910119778
申请日期
1991.05.24
申请人
MITSUBISHI ELECTRIC CORP
发明人
NAKANO HIROBUMI
分类号
H01L23/522;H01L21/768
主分类号
H01L23/522
代理机构
代理人
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地址
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